Hallo Hightechfreaks! ALD(Atomic Layer Dep.)?
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| Eröffnet am: | 08.03.02 22:17 | von: Dr.UdoBroem. | Anzahl Beiträge: | 4 |
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ALD Volume Production in 2002 Predicts Genus: $1 Billion Market Within Five Years States
VLSI Research
MONDAY, MARCH 04, 2002 8:02 AM
- PRNewswire
SUNNYVALE, Calif., Mar 4, 2002 /PRNewswire-FirstCall via COMTEX/ -- With confidence brewing following the
launch of its commercialization phase and early-year atomic layer deposition (ALD) wins, Genus (GGNS) CEO Bill
Elder claimed, during his company's recent fourth quarter conference call, that volume production of atomic layer
deposition (ALD) technology in semiconductor manufacturing will occur in 2002.
"ALD is solving many of the semiconductor industry's key technological problems in deposition," said Risto
Puhakka, vice president of VLSI Research. "We expect ALD to be a billion dollar market opportunity for companies
with the right technological solution to enable the chip makers roadmaps. Genus is clearly positioned to exploit this
opportunity."
Genus ALD is already qualified for volume production in the data storage industry. Volume production within the
semiconductor industry is expected during the second half of 2002 for DRAM and embedded DRAM manufacturing.
Genus has shipped systems to four of the top-five DRAM manufacturers worldwide.
"As DRAM manufacturers transition to smaller geometry sizes of 0.13 micron and below, ALD becomes the enabling
deposition technology," stated Werner Rust, Genus' vice president of sales and marketing. "With the data storage
industry already reaping the benefits, we predict ALD will be in volume production lines in semiconductor
manufacturing in the second half of 2002. With all the work we have done with the tier-one manufacturers since
identifying this market as the first semiconductor segment to adopt ALD, we consider ourselves as the supplier of
choice. We have not lost a technology run-off against any ALD competitor in more than a year."
Genus identified four keys segments of the thin film deposition market that require ALD capability. In addition to
DRAM manufacturing and non-semiconductor applications like data storage, Genus also highlighted gate stack for
logic and back end of line (BEOL) interconnect as future markets.
The gate stack market is a potentially larger market than capacitors. However, material choices are still to be made
in this area prior to the adoption of ALD technology. Genus believes ALD will be a 300 mm requirement in this
market and envisages volume production in 2004. Genus has shipped what is believed to be the industry's first 300
mm ALD system into this market to the Azuka project, a Japanese 300 mm consortium. Regarding the BEOL
interconnect market, Genus predicts that ALD will not be required until the 0.07-micron node and is not currently
pursuing this market.
About ALD
Both the semiconductor and data storage industries continue to migrate toward products with higher density and
higher topology. As a result, conformality of deposited films has also become a critical factor. With current
technology unable to meet the degree of conformality required to manufacture today's leading-edge technology, the
use of Genus' ALD technology in the data storage market has been adopted. ALD enables manufacturers to extend
current semiconductor and data storage manufacturing processes by offering greater deposition conformality in
smaller feature components with higher aspect ratios.
About Genus
Genus, Inc. manufactures critical deposition processing products for the global semiconductor industry and the data
storage industry. To enable the production of intricate micro computer chips and electronic storage devices, Genus
offers its LYNX series production-proven equipment for 200mm and 300mm semiconductor production, and offers thin
film deposition products for chemical vapor deposition (CVD), atomic layer deposition (ALD), and pre-clean
capabilities. Genus is at the forefront of market and technology developments in the ALD marketplace, which is
gaining acceptance worldwide as a critical technology for sub 0.13-micron production of computer chips and
electronic storage devices. Genus' customers include semiconductor manufacturers located throughout the United
States, Europe and the Pacific Rim including Korea, Japan and Taiwan. Founded in 1981, the company is
headquartered in Sunnyvale, California. For additional information visit Genus' web site at www.genus.com.
LYNX2(R) and LYNX3(TM) are trademarks of Genus, Inc.
Ich habe mit dem Wert schon mehr oder weniger erfolgreich getradet, aber vielleicht sollte man länger investiert bleiben? Wenn das so stimmt, könnten mittelfristig locker 100% drin sein, oder? (4$ auf 8$)
Würde zum Einstieg aber einen Pullback abwarten wg. überkauft und Widerstand bei 4$.
Gruß Doc Broemme
layer=Schichten
deposition=Ab- bzw. Ausscheidung
Frei übersetzt:
ADL=Elektrochemisches Verfahren zur Abscheidung ultradünner Schichten.
Interessanter Link zum Thema:
http://www.hbi.de/clients/Agere_Systems/pms01/...arch_iedm2001_dt.php
Der Artikel bezieht sich auf die Agere Systems (NYSE: AGR.A), die ebenfalls
an der ADL-Technologie forscht und bereits ein praxistaugliches Verfahren entwickelt haben soll.
Ein "großes Ding in der zukünftigen Chipindustrie" ist die ADL-technologie mit Sicherheit, denn mit der heutigen Technologie lassen sich die Transistor-Strukturen nicht in alle Ewigkeit verkleinern(Mooresches Gesetz: Verdoppelung der Chip-Komplexität alle 18 Monate).
Die Frage ist nur, ob Genus tatsächlich in dem Masse profitieren wird wie sie in ihrer PR-Mitteilung verlautbaren. Denn neben einigen kleinen Unternehmen wie die Agere Systems sind auch Konzerne wie Intel, Infineon usw mit riesigen Forschungsetats in diesem Bereich tätig. So gesehen ist der "$1 Billion Market"
(zu Deutsch 1 Mrd USD) gar nicht mal so groß.
Falls Du mit dem Wert zocken willst, kommt es eigentl. es nur darauf an wie gut die Kurspflege bei denen funktioniert. D.h. in welchen Abständen sie PR-Meldungen wie die obige herausgeben.
Thx für den Tipp:-)
Nowonder
Monday February 11, 8:02 am Eastern Time
Press Release
SOURCE: Genus, Inc.
Acceptance Continues: World's Number One Data
Storage Company Adopts Genus' ALD Technology
Second Win in Recent Weeks Drives Global Acceptance
SUNNYVALE, Calif., Feb. 11 /PRNewswire-FirstCall/ -- The growing worldwide acceptance of the critical atomic layer deposition (ALD) market received another boosttoday when ALD market leader Genus, Inc. (Nasdaq: GGNS - news) announced its second success in as many weeks. The world's largest manufacturer of disc drives,magnetic discs and thin-film heads ordered Genus' LYNX2® ALD technology for its
primary thin-film head manufacturing facility in Europe. Shipment is scheduled for the first
quarter of 2002.
The rapid speed in which the customer moved in placing this order further demonstrates the acceptance of Genus' unique atomic layer process technology in key target markets
and applications. The drive toward adoption and volume production of Genus' ALD products has garnered tremendous momentum. Beginning early last year, its business has
been growing aggressively with rapid and ongoing acceptance of systems targeting the semiconductor industry and later successes in non-semiconductor markets such as the data storage market.
``This order further demonstrates our ability to execute our business plan through the penetration of key accounts in selected markets,'' stated Bill Elder, Genus CEO. ``We are
undergoing rapid transformation from technology development breakthrough to full blown and rapid commercialization of our 200 mm and 300 mm ALD product lines both for semiconductor chip devices and data storage applications. Over the last several years we have worked hard to develop ALD as the production technology of the future for high
quality ultra thin films. In 2002 we will see the second phase of our effort as our ALD technology moves into full production with many of our customers.''
``This is a tier one customer that selected the Genus ALD product line because we demonstrated our technology as being the best-in-class,'' commented Werner Rust, vice president of sales and marketing at Genus. ``The decision to adopt our ALD technology is very much in keeping with the customer's desire to invest in leading-edge production grade technology that will allow it to expand its leadership position in the global data
storage industry.''
This deal represents yet another major win for Genus since it publicly implemented its rapid commercialization phase of its ALD program in November 2001. ``We are experiencing a sharp increase in activity from potential customers in our targeted market sectors,'' said Elder. ``ALD adds value and brings significant performance and cost benefits to a variety of manufacturing processes. As we move further into 2002 we expect to add further development and production stage customers, be it sub 0.13-micron IC production or data storage devices, as these added-value, performance and cost benefits are recognized.''
Etwas störend finde ich die Geheimnistuerei "World's Number One Data Storage Company" - Wer mag das sein?
Gruß Dr. Broemme
Noch ein Bsp.:
"Genus has shipped systems to four of the top-five DRAM manufacturers worldwide."
Von einem milliardenschweren Auftrag bis hin zum Versand von ungebetenem Werbematerial kann dies alles mögliche bedeuten.
Da man nichts genaueres weiss eignet sich die Aktie eigentl. nur zum Zocken.
Interessant ist sie in der Tradingrange zw. 2 und 4 USD.
Als Langfristanlage würde ich den Wert nicht empfehlen, es gibt zu viele Ungereimtheiten. Da hat die Agere Systems (NYSE: AGR.A) bei mir einen kompetenteren Eindruck hinterlassen, auch Fundamental sieht es bei der Agere Systems um einiges besser aus.
Hier einige Speichertechnologien die meiner Meinung nach interessanter sind:
MRAM: Hier spielt der Platzbedarf eine geringe Bedeutung, auf Kondensatoren könnte man mit dieser Technik sogar ganz verzichten. Weitere Vorteile sind geringe Herstellungskosten und Nichtflüchtigkeit des Speicherinhalts.
Entwickelt wird dieser Speichertyp von Motorola sowie von IBM/Infineon.
Polymer-Speicher: Die Entwicklung wird vor allem durch Opticom(Wkn 907857) vorangetrieben. Meiner Meinung nach ein Üernahmekandidat:
TFE und Intel erweitern Pläne für Plastik-Speicher-Chips
Vom Prototypen zur Entwicklung von Fabrikationsprozessen für Polymer-Chips
Die Opticom-Tochter Thin Film Electronics (TFE) und Intel haben ihre Zusammenarbeit bei der Entwicklung von Polymer-Speicher-Chips erweitert. Nach der Entwicklung von Prototypen will man nun einen Schritt weiter gehen und Fabrikationsprozesse für Polymer-Speicher-Chips entwickeln.
Im Kommen: Plastik-Speicher
Die Forschung soll in einer von Intels Wafer-Fabrikations-Anlagen in Hillsboro, im US-Staat Oregon stattfinden. TFE wird jedoch weiterhin parallel in seinen Laboratorien in Linkoping, Schweden, seine eigenen Forschungen betreiben. Für den gemeinsam genutzten Teil der Forschung wird Intel die finanziellen Mittel bereitstellen.
Laut Intel erreicht man damit eine neue Phase in der Entwicklung kosteneffektiver, massenproduktionstauglicher Fabrikationsprozesse und passender Speicherchips auf Kunststoff-Basis. Von Polymer-Speicher-Chips verspricht man sich im Vergleich zu ihren Silizium-Pendants deutlich geringere Herstellungskosten, geringeren Stromverbrauch und größere Speicherkapazitäten. Letzteres wird durch das Übereinanderstapeln ("3D-Chips") von mehreren extrem dünnen Polymer-Schichten erreicht.
http://www.golem.de/0201/17930.html
Nowonder